One Partner. Full Test-Interface Coverage. — Meet UIGreen at SEMICON Europa 2026, Messe München, 10–13 November 2026, Booth C2165.

UIGreen — One Partner. Full Test-Interface Coverage. SEMICON Europa, November 10th–13th 2026, Messe München, Booth C2165.
10–13 November 2026 · Messe München · Booth C2165Book a booth meeting

Meet us at the show

Two precision interfaces.
One engineering conversation.

Send your package and test requirement before the show; our application engineers will bring the relevant high-speed coaxial socket and elastomer contactor samples — plus a first-pass recommendation — to your slot in Munich.

20,000
High pin count
45–80 GHz
Coaxial @ −1 dB
350 µm
Elastomer pitch
300k
Coaxial cycles

Find us at Booth C2165, Messe München. A confirmed 30-minute time slot is returned by email after you request a meeting.

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Products to discuss
Founded 2007, Suzhou
SSE STAR Market 688661.SH
1,000+ patents
Serving 16+ countries & regions

Top sale products for your review at booth

High-speed coaxial and fine-pitch elastomer, under one roof

Both lines are manufactured in-house under a single quality system, from individual precision contacts to finished socket assemblies. Every value below is cited from the official UIGreen product brochure.

High-speed coaxial test socket — high pin count assembly with fine-pin array
High pin count · mm-Wave

High-Speed Coaxial Test Socket

Coaxial high-frequency socket for chip test — precise impedance control for high-speed, high-pin-count devices.

≥ 0.3mm
Minimum pitch
45–80GHz
Performance @ −1 dB
20,000
High pin count
300k
Contact cycles
  • Precise impedance matching with minimal signal loss
  • Stable, consistent contact across large arrays
  • Built for repeatable high-volume test and lower cost of test
Bring a high-pin-count / RF DUTDiscuss at the booth
Elastomer contactor — floating DUT on fine-pitch conductive elastomer array
Fine pitch · Ball-safe

Elastomer Contactor

Flexible, conductive elastomer contact for dense area-array packages — gentle on delicate bumps and balls.

350µm
Fine pitch
< 100mΩ
Contact resistance
No ball damage
Flexible contact
Dense arrays
High-yield contact
  • Flexible conductive contacts protect fragile bumps and balls
  • Short signal path with minimal signal loss
  • High and stable yield in high-density array test
Bring a ball-sensitive packageDiscuss at the booth

Full test-interface coverage

One partner across the full test interface

Beyond the two featured sockets, UIGreen covers the broader chip-test interface portfolio shown in the product brochure.

Test sockets

WLCSP, RF high-frequency, coaxial high-frequency and burn-in sockets.

Probes

Vertical MEMS, cantilever, blade, elastomer, buckling-beam and pogo-pin probes.

Probe cards

Cantilever, vertical and MEMS probe-card solutions.

Precision connectors

RF coaxial, board-to-board, pogo-pin magnetic and high-current power connectors.

Where they run

Across the semiconductor ecosystem

AI & high-performance computing

High-pin-count, high-bandwidth device test for accelerator and advanced-logic packages.

5G / RF & communication

mm-Wave signal integrity through impedance-matched coaxial interfaces.

Automotive & power

Reliable contact across extended-temperature and high-current test regimes.

Consumer & memory

High-yield, ball-safe contact for dense, cost-driven area-array packages.

Bring your package drawing to Munich

30-minute one-to-one review · datasheets sized to your pitch, frequency and current.

Reserve a technical meeting

Why UIGreen

Micro-precision, built in-house and supported globally

2007

Two decades in micro-precision

Dedicated to MEMS and semiconductor chip testing, from front-end basic test to back-end final test.

One-stop

Components to system level

Technology-driven one-stop solutions spanning precision components through system-level integration.

4

Global support network

Subsidiaries in Japan, the USA, Switzerland and Singapore, serving 16+ countries and regions.

100%

In-house under one quality system

Contacts through finished socket assemblies are made in-house, with high-standard quality control and reliable capacity.

One partner. Full test-interface coverage.

10–13 November 2026 · Messe München · Booth Number C2165

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